Unique Selling Points

1. Shelf life
9 months instead of 6 months
Date of manufacturing on the packing
2. Stencil life = paste on stencil
- relative humidity 40-60%
- temperature 20-25°C
=> 24h-48h
3. Board life = paste on PCB
- time between paste printing and final component placement
- relative humidity 40-60%
- temperature 20-25°C
=> 24h-48h
4. Tack time - time that the eC-solderpaste keeps its tackiness = more than 8h after printing
5. PiP - suitable for pin-in-paste technology
6. Guaranteed Halogen free
ROL0 = Rosin - Low activity - 0 Halogen
Halogen
- IPC standard = 500 ppm
- European standard = 100 ppm
- eC-solderpaste = 0 ppm
7. 140Gr Jar instead of 500Gr Jar
- less waste
- more economic price
8. no clean solder paste